Luca Gautero, SÜSS MicroTec
Exploring the many opportunities and challenges offered by inkjet as an advanced method of solder mask application.
Latest Column: Additive Reality: Drop It, and Enjoy the Greenback
Travis Kelly, PCBAA
This column will cover the support and growth of U.S. domestic printed circuit board (PCB) manufacturers and suppliers as they contribute to national security.
Marc Carter, Aeromarc LLC
This is a series of columns or articles based on a course at Michigan Tech on PCB design, manufacturing, and assembly.
Barry Olney, In-Circuit Design Pty. Ltd.
Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.
Latest Column: Beyond Design: The Eye Diagram
Kim O'Neil, Prototron Circuits
Kim discusses the daily challenges of running an American PCB fabricaton facility.
Latest Column: Circuit Chronicles: It’s All About the Team
Dan Beaulieu, DB Management
Dan Beaulieu reviews new and classic books on succeeding in business.
Latest Column: Dan’s Biz Bookshelf: ‘What Customers Hate’
Dana Korf, Korf Consultancy LLC
Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.
Latest Column: Dana on Data: An IPC APEX EXPO 2023 Data Transfer Mission
Dennis Fritz, Fritz Consulting
Dennis covers military and defense industry topics and applications.
Vern Solberg, Consulting
This column will focus on technical issues related to PCB and Flex circuit design, etc.
Dominique Numakura, DKN Research
Dominique Numakura offers weekly updates on the PCB industry in Japan, from M&A activity to technological breakthroughs.
Latest Column: EPTE Newsletter: Travel to Japan During COVID
Dan Feinberg, FeinLine Associates, Inc.
End-user technology and special features on end-user high technology products.
Joe Fjelstad, Verdant Electronics
As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.
Latest Column: Flexible Thinking: A Patently Innovative Resolution
IPC Education Foundation, IPC
IPC Education Foundation updates on programs and activities.
Happy Holden, I-Connect007
Happy will endeavor to catch our readers up on the latest technologies developed around the world since Karl Dietz retired this column in 2016.
Latest Column: Happy’s Tech Talk #16: Protocols for a Smart Factory Future
Dan Beaulieu, DB Management
This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.
Marc Ladle, Viking Test Ltd.
Marc’s columns deal with various aspects of PCB production, focusing especially on troubleshooting production problems.
Latest Column: Ladle on Manufacturing: LED UV Cure—Does It Really Work?
John Coonrod, Rogers Corporation
John Coonrod offers PCB designers advice on modern laminates, with a focus on high-speed substrates.
Doug Sober, Essex Technologies Group
Doug writes about the problems of & concerns with PCB laminate materials and their specifications.
Nolan Johnson, I-Connect007
Nolan brings 30 years of career experience focused almost entirely on electronics design and manufacturing.
Latest Column: Nolan’s Notes: The Trade Show Is Over—Now What Do You Do?
John Mitchell, IPC
John will cover issues affecting the entire global electronics industry supply chain.
Latest Column: One World, One Industry: Advance in a New Era
Tara Dunn, Averatek
When it comes to additive circuits, Tara really knows what she is talking about!
Latest Column: PCB Talk: Is DWM Just Another Buzzword?
Tom Kastner, GP Ventures, Ltd.
'Punching Out' is a series of articles on mergers and acquisitions in the PCB and assembly sectors.
Latest Column: Punching Out: Here’s the Deal About 2022
Anaya Vardya, American Standard Circuits
This column strives to make all facets of printed circuit board technology clear and easy to understand.
Latest Column: Standard of Excellence: Progress Through Partnership
Todd Kolmodin, Gardien Services, USA
Todd covers a range of electrical test and reliability issues.
Latest Column: Testing Todd: Coming Back to Life—Design Recovery
Mark Thompson, Out of the Box Manufacturing
Mark Thompson discusses PCB design from a fabricator's viewpoint, with a focus on DFM issues.
Latest Column: The Bare (Board) Truth: My Top Six Design Challenges
Mehul Davé, Entelechy Global and Linkage Technologies
Mehul's column explores benefits for outsourcing CAM engineering.
Latest Column: The Big Picture: The Virtual Via Drum
Christopher Bonsell, Chemcut
Discussions about topics concerning wet processes, wet processing equipment, and how changes in these areas can improve the PCB industry.
Latest Column: The Chemical Connection: Basics of Cupric Chloride Etchant
Chris Mitchell, IPC
In this column, IPC VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.
Latest Column: The Government Circuit: Building Industry Resilience in 2023
Hannah Nelson & Paige Fiet, IPC Student Directors
Two up and coming engineers discuss the bridge between electronics education and the electronics industry.
Latest Column: The New Chapter: A Tale of Two Towers
Team Elmatica, Elmatica
The PCB Norsemen from Elmatica share their knowledge, experience, technical advice, and thoughts about the fascinating world of PCBs.
George Milad, Uyemura International Corporation
George's columns cover PCB plating, IPC specifications, and more
Martyn Gaudion, Polar Instruments
In his column, Martyn discusses signal integrity and impedance design test.
Latest Column: The Pulse: Fitting Physics to Fact
Steve Williams, The Right Approach Consulting
A no-nonsense view of manufacturing and management strategies from one of electronic manufacturing's top authorities.
Andy Shaughnessy, I-Connect007
Andy Shaughnessy discusses topics that are important to the community of PCB designers and design engineers.
Latest Column: The Shaughnessy Report: PCB Design and Advanced Packaging
Michael Carano, Averatek
A comprehensive look at plating, metallization processes and PWB fabrication techniques.